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mspsim
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Merged into se.sics package and added license.

This commit is contained in:
lebrush 2013-06-04 11:34:23 +02:00
parent cae87d038b
commit c7c49df7ee
3 changed files with 107 additions and 41 deletions
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40
com/tado/mspsim/chip/TemperatureChip.java
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@ -1,40 +0,0 @@
package com.tado.mspsim.chip;
/**
* Interface for a temperature chip.
*
* Implementing this interface makes it compatible with the cooja-interfaces
* and hence makes the peripheral implementation way easier
*
* @author Víctor Ariño <victor.arino@tado.com>
*/
public interface TemperatureChip {
/**
* Get the current temperature on the chip
*
* @return
*/
public int getTemperature();
/**
* Set a new temperature on the chip
*
* @param temp
* temperature to set in XXYY format where XX.YY°C
*/
public void setTemperature(int temp);
/**
* Get the maximum temperature allowed by the chipset
*
* @return
*/
public int getMaxTemperature();
/**
* Get the minimum temperature allowed by the chipset
*
* @return
*/
public int getMinTemperature();
}

35
com/tado/mspsim/chip/TMP112.java → se/sics/mspsim/chip/TMP112.java
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@ -1,4 +1,37 @@
package com.tado.mspsim.chip;
/* Copyright (c) 2013, tado° GmbH. Munich, Germany.
* All rights reserved.
*
* Redistribution and use in source and binary forms, with or without
* modification, are permitted provided that the following conditions
* are met:
* 1. Redistributions of source code must retain the above copyright
* notice, this list of conditions and the following disclaimer.
* 2. Redistributions in binary form must reproduce the above copyright
* notice, this list of conditions and the following disclaimer in the
* documentation and/or other materials provided with the distribution.
* 3. Neither the name of the Institute nor the names of its contributors
* may be used to endorse or promote products derived from this software
* without specific prior written permission.
*
* THIS SOFTWARE IS PROVIDED BY THE INSTITUTE AND CONTRIBUTORS ``AS IS'' AND
* ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE
* IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
* ARE DISCLAIMED. IN NO EVENT SHALL THE INSTITUTE OR CONTRIBUTORS BE LIABLE
* FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
* DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS
* OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION)
* HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT
* LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY
* OUT OF THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF
* SUCH DAMAGE.
*
* This file is part of MSPSim.
*
* Author: Víctor Ariño <victor.arino@tado.com>
*
*/
package se.sics.mspsim.chip;
import se.sics.mspsim.core.MSP430Core;
import se.sics.mspsim.core.USARTSource;

73
se/sics/mspsim/chip/TemperatureChip.java Normal file
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@ -0,0 +1,73 @@
/* Copyright (c) 2013, tado° GmbH. Munich, Germany.
* All rights reserved.
*
* Redistribution and use in source and binary forms, with or without
* modification, are permitted provided that the following conditions
* are met:
* 1. Redistributions of source code must retain the above copyright
* notice, this list of conditions and the following disclaimer.
* 2. Redistributions in binary form must reproduce the above copyright
* notice, this list of conditions and the following disclaimer in the
* documentation and/or other materials provided with the distribution.
* 3. Neither the name of the Institute nor the names of its contributors
* may be used to endorse or promote products derived from this software
* without specific prior written permission.
*
* THIS SOFTWARE IS PROVIDED BY THE INSTITUTE AND CONTRIBUTORS ``AS IS'' AND
* ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE
* IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
* ARE DISCLAIMED. IN NO EVENT SHALL THE INSTITUTE OR CONTRIBUTORS BE LIABLE
* FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
* DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS
* OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION)
* HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT
* LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY
* OUT OF THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF
* SUCH DAMAGE.
*
* This file is part of MSPSim.
*
* Author: Víctor Ariño <victor.arino@tado.com>
*
*/
package se.sics.mspsim.chip;
/**
* Interface for a temperature chip.
*
* Implementing this interface makes it compatible with the cooja-interfaces
* and hence makes the peripheral implementation way easier
*
* @author Víctor Ariño <victor.arino@tado.com>
*/
public interface TemperatureChip {
/**
* Get the current temperature on the chip
*
* @return
*/
public int getTemperature();
/**
* Set a new temperature on the chip
*
* @param temp
* temperature to set in XXYY format where XX.YY°C
*/
public void setTemperature(int temp);
/**
* Get the maximum temperature allowed by the chipset
*
* @return
*/
public int getMaxTemperature();
/**
* Get the minimum temperature allowed by the chipset
*
* @return
*/
public int getMinTemperature();
}